HIGH SPEED MICROPROCESSOR HEAT-EXCHANGER
One of the barriers to increasing microprocessing clock speed is the extreme difficulty to move heat out of the CPU chip. Wits researchers have developed a cold spraying heat exchanger manufacturing technique where thin layers of copper and aluminium are deposited on a copper substrate. De-alloying is then used to remove the aluminium in order to form microchannels.
Computation modeling and simulation analysis of the thermal-mechanical performance of the resulting trapezoidal micro-channels showed better temperature extraction capabilities than other shapes making it suitable for integration into microfluidic cooling systems very high-speed microprocessors, such as those used in supercomputers.